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Hooked Signs Software Agreement with QUALCOMM for Development of 3D Test Applications

Hooked to develop 3D graphic test and verification suite

Hooked Wireless, Inc. has entered into a software development agreement with QUALCOMM Incorporated of San Diego, CA to develop a test and verification suite for OpenGL® ES on QUALCOMM MSM™ chipset solutions that include 3D graphics hardware.

QUALCOMM's MSM chipsets enable cost-effective mobile handsets with advanced capabilities that leverage 3G technology yet minimize the development time. The Q3Dimension solution, which enables wireless handsets to feature advanced 3D graphics performance comparable to many dedicated game devices today, is fully integrated into QUALCOMM's MSM chipsets and eliminates the need for a separate co-processor.

The test suite developed for this project supplements the OpenGL ES conformance test suite that Hooked developed for the Khronos Group, resulting in more consistent and reliable product across multiple phones. Khronos (www.khronos.org) is the organization that controls the OpenGL ES specification.

"This is a natural extension of the work that we've done for Khronos", said Mike Bruno, CEO of Hooked. "We are thrilled to be doing this work for a company as important and successful as QUALCOMM. They are one of the key leaders of the wireless industry, and a pioneer in Code Division Multiple Accesss (CDMA) and other advanced wireless technologies".

For further information, please write to sales@hookedwireless.com, or contact Chris Braden, VP Business Development for Hooked, at 408-410-0710.

OpenGL is a registered trademark and the OpenGL ES logo is a trademark of Silicon Graphics Inc. used by permission by Khronos.